A new high-performance socket handles 0.4-mm-pitch BGA 25-pin devices. The CG-BGA-5030 socket is designed for the 2.125×2.225-mm package size and operates at a bandwidth up to 30 GHz with less than 1 dB of insertion loss. The socket is designed with an ea
2019-05-09Infineon Technologies AG is launching its first magnetic sensors based on TMR technology. This makes the company the world’s first sensor manufacturer to offer magnetic sensors based on all four magnetic technologies: HALL, GMR, AMR and TMR. Infineon will
2019-05-05D3 Engineering has introduced a new line of rugged camera modules for automotive and industrial vision. The new DesignCore D3RCM Rugged Camera Modules integrate OmniVision or SONY image sensors with Texas Instruments’ FPD-Link III SerDes for full digital
2019-05-05Wolfspeed announces E-Series, a new family of robust SiC semiconductor devices for the Electric Vehicle (EV) and renewable energy markets that delivers the highest available power density and durability for on-board automotive power conversion systems, of
2019-05-05Infineon Technologies AG is launching two new System Basis Chip (SBC) families: Lite and Mid-Range+. They are the first SBCs on the market supporting the ISO CAN FD protocol for communication at 5 Mbit/s for a large variety of automotive applications | pc
2019-05-05To address the increasing demand for large-scale digital instrument clusters among all class of vehicles, Renesas Electronics Corporation extends the scalable range of the R-Car family of system-on-chip (SoC) devices with the introduction of the R-Car E3
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